4860P-35G Sn63/Pb37 No Clean Solder Paste MG Chemicals

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Sn63/Pb37 No Clean Solder Paste

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Manufacturer: MG Chemicals

www.mgchemicals.com

Our Price: $28.55

Mfg Part Number: 4860P-35G

Availability: Available
Product Code: 4860P-35G_M100

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Description

Technical Specs

4860P – Sn63/Pb37 solder paste, also known as Sn63 solder paste or 63 37 solder paste, is a no-clean solder paste that is made from a blend of high purity, non-recycled tin and lead alloy powder combined with a no-clean flux to form a paste. It is designed for surface mount applications and provides high tack force and good wettability. The post-soldering residues are transparent, nonconductive, non-corrosive, and highly insulated. (“No-clean” means that residues are not harmful to assemblies.)

Sn63/pb37 solder paste is designed for use in high-speed printing and is an ideal choice for SMT solder paste printers. It can yield brick-like prints even when using ultra-fine pitch stencils as small as 0.3 mm.

MG4860P Sn63/Pb37
Shelf Life (Syringe)		6 Months - (30-50°F/2-10°C)
Melting Point, °C		183 E
Hardness, Brinell		14HB
Coefficient of Thermal Expansion		24.7
Tensile Strength, psi		4442
Density, g/cc		8.42
Electrical Resistivity , (µohm- cm)		14.5
Electrical Conductivity, 104/ohm-cm		6.9
Yield Strength, psi		3950
Total Elongation,%		48
Joint Shear Strength, at 0.1mm/min 20 °C		23
Joint Shear Strength, at 0.1mm/min 100 °C		14
Creep Strength, N/mm2 at 0.1mm/min 20 °C		3.3
Property	Specification		TestMethod
Flux Classification	REL0	JSTD-004
Copper Mirror	No removal of copper film	IPC-TM-650 2.3.32
Corrosion	Pass	IPC-TM-650 2.6.15
SIR
JSTD-004	2.44x1010ohms	IPC-TM-650 2.6.3.3
Bellcore (Telecordia)	4.10x1010ohms	Bellcore GR-78-CORE 13.1.3
Electromigration	Pass	Bellcore GR-78-CORE 13.1.4
Post Reflow Flux Residue	45%	TGA Analysis
Acid Value	110	IPC-TM-650 2.3.13
Metal Loading	88%	IPC-TM-650 2.2.20
Viscosity
Brookfield(1),kcps	400+/-10% kcps	IPC-TM-650 2.4.34 modified
Malcom(2),poise	850-1100	IPC-TM-650 2.4.34.3 modified
Slump Test
25 °C, 0.63 vertical/horizontal	No bridges all spacings	IPC-TM-650 2.4.35
150 °C, 0.63 vertical/horizontal	No bridges all spacings	IPC-TM-650 2.4.35
25 °C, 0.33 vertical/horizontal	0.20 /0.20	IPC-TM-650 2.4.35
150 °C, 0.33 vertical/horizontal	0.20/0.20	IPC-TM-650 2.4.35
Solder Ball Test	Pass	IPC-TM-650 2.4.43
Tack
Initial	85 gm	JIS Z 3284
Tack retention @ 24 hr	90 gm	JIS Z 3284
Tack retention @ 24 hr	82 gm	JIS Z 3284

Reflow Best results have been achieved when MG 4860P is reflowed in a forced air convection oven with a minimum of 8 zones (top & bottom), however reflow is possible with a 4 zone oven (top & bottom). The following is a recommended profile for a forced air convection reflow process. The melting temperature of the solder, the heat resistance of the components, and the characteristics of the PCB (i.e. density, thickness, etc.) determine the actual reflow profile.

Preheat Zone - The preheat zone, is also referred to as the ramp zone, and is used to elevate the temperature of the PCB to the desired soak temperature. In the preheat zone the temperature of the PCB is constantly rising, at a rate that should not exceed 2.5 C/sec. The oven’s preheat zone should normally occupy 25-33% of the total heated tunnel length. The Soak Zone - normally occupies 33-50% of the total heated tunnel length exposes the PCB to a relatively steady temperature that will allow the components of different mass to be uniform in temperature. The soak zone also allows the flux to concentrate and the volatiles to escape from the paste. The Reflow Zone - or spike zone is to elevate the temperature of the PCB assembly from the activation temperature to the recommended peak temperature. The activation temperature is always somewhat below the melting point of the alloy, while the peak temperature is always above the melting point.