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Slow Cure Thermal Conductive Adhesive
Slow Cure Thermal Conductive Adhesive


 
Our Price: $24.95
Mfg Part Number: 8329TCS-6ML


Availability: Available
Product Code: 8329TCS-6ML_M100
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Description
 
The 8329TCS Slow Cure Thermal Conductive Adhesive is an electronically insulating epoxy that combines long working time and high conductivity with ease of use. It has a convenient 1-to-1 mix ratio and 4 hours pot life. Due to this long pot life, the mixed adhesive essentially behaves like a 1-part adhesive for the duration of a work shift. However, unlike 1-part adhesives, it doesn’t require temperatures as high as 130 and 170 °C, and it will cure at a more moderate 80 °C in less than 1 hour. The cured adhesive bonds very well to most substrates used in electronic assemblies; and resists thermal and mechanical shocks.
Features
  • Good low temperature alternative to 1-part TC adhesives with inconveniently high cure temperature
  • Excellent 1.44 W/(m•K) thermal conductivity
  • Easy 1:1 mix ratio
  • Adheres to most electronic substrates
  • Stores and ships at slightly below room temperature — no freezing or dry ice required
  • Very long shelf life of at least three years — even when stored at room temperature
  • Strong water and chemical resistance to brine, acids, bases, and aliphatic hydrocarbons

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