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8327GF25 - Thermal Gap Filler - Silicone - Thermal Conductivity 2.5 W/(m·K)
8327GF25 - Thermal Gap Filler - Silicone - Thermal Conductivity 2.5 W/(m·K)


 
Manufacturer: MG Chemicals
Mfg Part Number: 8327GF25-50CC


Availability: Currently Unavailable
Product Code: 8327GF25-50CC_M100
No Longer Available

Description Technical Specs
 
8327GF25 is a two-component, flame retardant, thermally conductive silicone gap filler. It is a smooth, non-sagging paste that easily conforms to the complex shapes of any interface design. The cured product creates a thermal path that efficiently dissipates
heat from electronic devices. It retains its softness after cure which maximizes stress relief during thermal cycling. 8327GF25 can be used as a liquid alternative for prefabricated solid thermal pads.
Features
  • High thermal conductivity
  • Quick low-temperature cure
  • Easy to use
  • Flame retardant—meets UL 94V-0
  • Reworkable
  • Resistivity 6.0 x 1014 Ω·cm
  • Thermal Conductivity 2.5 W/(m·K)
  • Thermal Resistance 35 (mm2·K)/W
  • CTE -153 ppm/°C
  • Dielectric Strength 508 V/mil
  • Density 2.90 g/cm3
  • Tensile Strength 0.4 MPa
  • Elongation 70%
  • Hardness 50 E
  • Low Volatile Siloxane (D4-D10) 200 ppm
  • Relative Temperature Index (RTI) 150 °C (planned)
  • Working Time 4 h
  • Cure Time 24 h @ 22 ˚C or 30 min @ 70 ˚C
  • Viscosity @ 25 ˚C 100 Pa·s
  • Mix Ratio by Volume 1:1
  • Shelf Life 6 months

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