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8327GF41 - Thermal Gap Filler - Silicone - Thermal Conductivity 4.1 W/(m·K)
8327GF41 - Thermal Gap Filler - Silicone - Thermal Conductivity 4.1 W/(m·K)


 
Manufacturer: MG Chemicals
Mfg Part Number: 8327GF25-50CC


Availability: Currently Unavailable
Product Code: 8327GF41-50CC_M100
No Longer Available

Description Technical Specs
 
8327GF41 is a two-component, flame retardant, thermally conductive silicone gap filler. It is a smooth, non-sagging paste that stays firmly in place after being dispensed. The cured product creates a thermal path that efficiently dissipates heat from electronic devices. It retains its softness after curing which maximizes stress relief during thermal cycling. 8327GF41 can be used as a liquid alternative for prefabricated solid thermal pads. If lower viscosity is required, use 8327GF25.
Features
  • High thermal conductivity
  • Quick low-temperature cure
  • Easy to use
  • Flame retardant—meets UL 94V-0
  • Reworkable
  • Resistivity 1.0 x 1022 Ω·cm
  • Thermal Conductivity 4.1 W/(m·K)
  • Thermal Resistance 30 (mm2·K)/W
  • CTE -110 ppm/°C
  • Dielectric Strength 356 V/mil
  • Density 3.14 g/cm3
  • Tensile Strength 0.2 MPa
  • Elongation 40%
  • Hardness 45 E
  • Low Volatile Siloxane (D4-D10) 150 ppm
  • Relative Temperature Index (RTI) 150 °C (planned)
  • Working Time 3 h
  • Cure Time 24 h @ 22 ˚C or 50 min @ 70 ˚C or 25 min @ 100 ˚C
  • Viscosity @ 25 ˚C 130 Pa·s
  • Mix Ratio by Volume 1:1
  • Shelf Life 6 months

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