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Medium Cure Thermal Conductive Adhesive
Medium Cure Thermal Conductive Adhesive


 
Our Price: $125.00
Mfg Part Number: 8329TCM-200ML


Availability: Available
Product Code: 8329TCM-200ML_M100
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Description
 
The 8329TCM Medium Cure Thermal Conductive Adhesive is an electronically insulating epoxy that combines moderate curing rate and high thermal conductivity. It has a convenient 1-to-1 ratio, a workable 45 minutes pot life, and a moderate curing rate. It may achieve a minimal service cure in seven hours at room temperature. The cured adhesive bonds very well to most substrates used in electronic assemblies; and resists thermal and mechanical shocks.
Features
  • Excellent 1.36 W/(m•K) thermal conductivity
  • Easy 1:1 mix ratio
  • Adheres to most electronic substrates
  • Stores and ships at slightly below room temperature — no freezing or dry ice required
  • Very long shelf life of at least two years — even when stored at room temperature
  • Strong water and chemical resistance to brine, acids, bases, and aliphatic hydrocarbons

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