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Thumbnail Filmstrip of Medium Cure Thermally Conductive Adhesive (Ratio 1:1), 50 ml (121 g), 2 jar kit Images
This heatsink adhesive paste is a 2-part, 1-1 epoxy system. It is a smooth, dark grey paste that cures to form a hard, durable, thermally conductive polymer. It provides strong electrical insulation and excellent protection from humidity, salt water, mild bases, and aliphatic hydrocarbons. It bonds well to metals, ceramics, glass, and most plastics used in electroni assemblies.
• Thermal conductivity of 1.4 W/(m K)
• 1:1 mix ratio
• Working time: 45 minutes
• Cure time: 24 hours room temperature or 1 hour at 65°C (149°F)
• Provides strong electrical insulation
• High mechanical strength
• Strong resistance to humidity, salt water, mild bases, and aliphatic hydrocarbons
Features
- Format: Cartridge, 50 ml (121 g)
| Manufacturer (aka Brand): | MG Chemicals |
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