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WSM-90 is a red water-soluble polymer that cures at room temperature. This material is formulated to resist the adhesion of solder to specified areas of the circuit board during the soldering operation. After the solder operation, WSM-90 can be removed with hot water (140F, 60C) leaving no residue. WSM-90 can be used with all types of fluxes.
Drying time varies according to mask thickness and relative humidity. Warm or cold dry air will quicken the drying time. Optimum coating thickness is 10 to 35 mils (.025 – 1 mm). For a thinner viscosity, water may be added up to 2% by weight.
WSM-90 is completely soluble in hot water, leaving no residue on the circuit board.
Drying time varies according to mask thickness and relative humidity. Warm or cold dry air will quicken the drying time. Optimum coating thickness is 10 to 35 mils (.025 – 1 mm). For a thinner viscosity, water may be added up to 2% by weight.
WSM-90 is completely soluble in hot water, leaving no residue on the circuit board.
Features
- Has a shelf life of 12 months from date of manufacture.
- can be stored at room temperature (72F, 22C) in an unopened container.
- completely soluble in hot water, leaving no residue on the circuit board.
- Warm or cold dry air will quicken the drying time.
- Format: Liquid, 225 ml (8 fl. oz)
| Manufacturer (aka Brand): | Contronic Devices |
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