IR3100 Infrared BGA and SMD Rework System - PCB size up to 12" x 12"

The IR 3100 can easily install and remove BGA, QFN, μBGA/CSP, Flip Chip and other SMD's. Featuring a 500W infrared (IR) top heater and a 1000W IR bottom preheater, the IR 3100 does not require nozzles. A specially-developed IR pyrometer provides non-contact, real-time, closed-loop temperature control throughout the reflow process. A Sodr-Cam Reflow Camera comes standard, allowing you to watch the entire reflow process in real time. The IR 3100's newly designed Windows-based software makes profiling incredibly simple for even the most advanced applications, providing intuitive set-up, multi-stage profiling, on-the-fly profile adjustment, flux-dipping, unlimited profile storage and much more.

Advanced Features

Ultra-High Precision Placement Capability: Motorized reflow head is driven by advanced stepper motor system providing smooth, high precision, repeatable movement with no drift, allowing for soft landing of components and 28μm (.0011") placement accuracy.

High Sensitivity Vacuum Pick: New Vacuum Pick design is more robust, utilizes an optical sensor, is counterweight balanced, and employs precision high-temperature linear ball bearings for maximum accuracy and sensitivity in placement and pick-up.

Sodr-Cam Reflow Camera: Provided Sodr-Cam allows the operator to verify the entire reflow process, including the exact moment of solder melt.

Height Adjustable Bottom-Side Preheater: High powered (1000W) IR preheater, is height adjustable from standard position up to 38mm (1.5") closer to the PCB for the most challenging high-thermal -mass boards.

High-Definition Optical Alignment System: Automated Vision Overlay System uses a beam-splitting prism, high intensity LEDs for shadow-free lighting and a new high definition 1080p camera for easy alignment.

Quad-Field Imaging for Large/Fine Pitch BGA's: Allows up to four corners of a large component (and its lands) to be viewed under high magnification, providing perfect alignment of outsized BGAs or fine-pitch QFPs.

Integrated Board Support Wand: Prevents warping or sagging during reflow, is extremely adjustable to clear parts on the bottom of PCB and is easily removed when not in use.

Power Distribution Graph: Provides a graphical analysis of the top heater output within each zone, helping the developer make necessary adjustments to either the bottom heater utilization, or ramp rate, to maximize thermal performance.

Sensor Offset: Allows the developer to easily match the pyrometer temperature reading to the actual solder temperature.