USD

CAD

0
Secure Checkout
Encapsulating and Potting Epoxy Compound (Black), 375 ml (12 oz) liquid

Thumbnail Filmstrip of Encapsulating and Potting Epoxy Compound (Black), 375 ml (12 oz) liquid Images

    Image are for reference only
    See Product Specifications

    Purchase Encapsulating and Potting Epoxy Compound (Black), 375 ml (12 oz) liquid
    MFG Part Number: 832B-375ML

    Encapsulating and Potting Epoxy Compound (Black), 375 ml (12 oz) liquid

    (0)
    (USD) $48.78

    Usually Ships in 3 to 5 Days
    Limited Quantity
    Limited Quantity icon
    Fee ?
    A one-time limited quantity surcharge of (USD) $7.09 will be added to your cart total
     
    Request a quote
    or
    832B is a general purpose, rigid, 2-part black epoxy that provides extreme environmental, mechanical and physical protection for printed circuit boards and electronic assemblies. Due to its low mixed viscosity, 832B can easily penetrate small gaps and cavities. It also provides excellent electrical insulation and protects components from static discharge, vibration, abrasion, thermal shock, environmental humidity, salt water, fungus, and many harsh chemicals.

    Technical Datasheet (TDS)

    Features

    • Extreme impact resistance (contains a form of nylon)
    • Extreme resistance to water and humidity allowing submersion if needed
    • Strong chemical resistance to brine, acids, bases, and aliphatic hydrocarbons
    • Opaque and extremely difficult to remove material providing high security for proprietary
    • designs
    • Good protection of electronics against corrosion, fungus, thermal shock, and static discharges
    • Easy 2A:1B mix ratio compatible with most dispensing equipment
    • Negligible Volatile Organic Content (VOC)
    • RoHS Compliant
    • Format: Liquid, 375 ml (12 fl. oz)
    Download Specifications Download Acrobat Reader

    Specifications

    Curing & Work Schedule
    Working Life60 minutes
    Shelf Life≥3 year
    Full Cureat 20°C [68°F]24 hour
    at 65°C [149°F]60 minutes
    at 80°C [176°F]45 minutes
    at 100°C [212°F]35 minutes
    Storage Temperature of Unmixed Parts16 to 27°C [60 to 80°F]
    Curing & Work Schedule
    Constant Service Temp.-30°C to 140°C [-22 to 284°F]
    Service Temperature<-30 | +145 °C [<-22 | +294 °F]
    Cured Properties - PhysicalTest Method
    ColorVisualBlack
    Density (at 26°C)ASTM D 7921.12 g/cm3
    Hardness(Shore D durometer)80D to 82D
    Tensile StrengthASTM D 63856.9 N/mm2 [8,250 lb/in2]
    ElongationASTM D 6383.3%
    Lap Shear StrengthASTM D 10024.2 N/mm2 [606lb/in2]
    Izod ImpactASTM D 2560.932 kJ/m2 [0.443 ft·lb/in]
    Compression StrengthASTM D 695155 N/mm2 [22,400lb/in2]
    ModulusASTM D 6952,590 N/mm2 [375,000 lb/in2]
    Flexural StrengthASTM D 790113.76 N/mm2 [16,500 lb/in2]
    ModulusASTM D 7902,940 N/mm2 [427,000 lb/in2]
    Cured Properties - ElectricalTest Method
    Breakdown VoltageASTM D 14951.9 kV @ avg. of 2.79 mm
    Dielectric StrengthASTM D 149472 V/mil [18.6 kV/mm]
    Volume ResistivityASTM D2575.3 x1012 ohm · cm
    Surface ResistivityASTM D2573.1 x1010 ohm
    Comparative Tracking IndexASTM D 3628Not established
    Dielectric Dissipation & ConstantASTM D 150-98dissipation, D constant, k’
    @ 60Hz0.007 D, 3.90 k'
    @1 kHz0.008 D, 2.95 k'
    @10 kHz0.013 D, 2.89 k'
    @100 kHz0.018 D, 2.83 k'
    @1 MHz0.017 D, 2.77 k'
    Cured Properties - ThermalTest Method
    Coefficient of Thermal Expansion (CTE)ASTM E 831104 ppm/°C
    Glass Transition Temperature (Tg)ASTM D 3418Not established
    Heat Deflection Temperature (HDT)ASTM D 64846.638°C [115.95°F]
    Uncured Properties - PhysicalPart APart B
    ColorBlackClear, Amber Tint
    Viscosity at 24°C [73°F]2,500 cP [2.5 Pa·s]11,000 cP [11.0 Pa·s]
    Density1.127 g/mL0.967 g/mL
    Flash Point154°C [309°F]110°C [230°F]
    OdorMildMusty
    Uncured Properties - PhysicalMixture (2A:1B)
    ColorBlack
    Viscosity at 24°C [73°F]3,300 cP [3.3 Pa·s]
    Density1.058 g/mL
    Mix Ratio by volume (A:B)2.0:1.0
    Mix Ratio by weight (A:B)2.3:1.0
    Solids Content (w/w)99%
    Chemical Solvent Resistance
    Weight Change 3 daysWeight Change 45 days
    Water< 0%< 1%
    Hydrocloric Acid< 0%< 1%
    Isopropyl Alcohol0.3%< 1%
    Mineral spirits0.3%0.3%
    Xylene2%9%
    Ethyl Lactate3%7%
    Iso Hexanes5%8%
    Acetone7%destroyed
    832B Peak Exotherm
    Sample Size (grams)Peak Exotherm (Temp. in °C)Time in Minutes
    5044155
    10063110
    50011065

    Manufacturer (aka Brand): MG Chemicals
    No Reviews Yet!
    Review this product
    Review Encapsulating and Potting Epoxy Compound (Black), 375 ml (12 oz) liquid