The 832HT High Temperature Epoxy Encapsulating and Potting Compound is an electronic grade epoxy designed for high temperature environments. It is also an ideal encapsulant for very chemically aggressive environments where extreme physical strength is required.
It protects against static discharges, shocks, vibrations, and mechanical impacts. It is extremely resistant to humidity, salt water, and harsh chemicals. It also helps protect intellectual property, and it much harder to remove than standard epoxy encapsulating compounds.
Applications & Usages
The 832HT epoxy is used to pot or encapsulate printed circuit assemblies. The protective cured epoxy improves reliability, operational range, and lengthens the life of electrical and electronic parts.
Its primary applications are to protect electronic devices in high temperature and chemically aggressive environments. It is used in the automotive, marine, aerospace, aviation, communication, instrumentation, and industrial control equipment.
Features | Applications |
|
|
Catalog Number | Sizes Available | Description |
---|---|---|
832HT-375ML | 340 ml (11.5 fl oz) | Liquid |
832HT-3L | 2.3 L (2.43 qt) | Liquid |
Features
- Maximum service temperature of 275C (527F)
- Extreme physical strength and chemical resistance
- Suitable for extreme environments, such as submersion in salt water, acids, bases, fuels, and alcohols
- Extremely difficult to remove - grants incredible technology protection
- Protects against strong vibrations, abrasions, and direct physical impact
- Format: Liquid, 2.55 L (2.7 qt)
Specifications
Curing & Work Schedule | ||
---|---|---|
Working Life | 60 minutes | |
Shelf Life | 5 year | |
Full Cure | at 20°C [68°F] | 24 hour |
at 65°C [149°F] | 60 minutes | |
at 80°C [176°F] | 45 minutes | |
at 100°C [212°F] | 35 minutes | |
at 130°C [266 °F] | 25 minutes | |
at 160°C [320 °F] | 15 minutes | |
at 200°C [392 °F]) | 10 minutes | |
Storage Temperature of Unmixed Parts | 16 to 27°C [60 to 80°F] | |
Curing & Work Schedule | ||
Constant Service Temp. | -30°C to 200°C [-22 to 392°F] | |
Max. Intermittent Temp. | +250 °C [+482 °F] | |
Min Intermittent Temp. | 40 °C [-40 °F] | |
Cured Properties - Physical | Test Method | |
Color | Visual | Black |
Density (at 26°C) | ASTM D 792 | 1.16 g/cm3 |
Hardness | (Shore D durometer) | 86D |
Tensile Strength | ASTM D 638 | 54.22 N/mm2 [7,864 lb/in2] |
Elongation | ASTM D 638 | 3.38% |
Lap Shear Strength | ASTM D 1002 | 12.37 N/mm2 [1,794 lb/in2] |
Flexural Strength | ASTM D 790 | 100.66 N/mm2 [14,600 lb/in2] |
Modulus | ASTM D 790 | 2,751 N/mm2 [399,000 lb/in2] |
Cured Properties - Electrical | Test Method | |
Breakdown Voltage @0.630 mm | ASTM D 149 | 26.4 kV |
Dielectric Strength | ASTM D 149 | 44.82 kV/mm [1138 V/mil] |
Breakdown Voltage @3.175 mm [1/8‖] | Reference fit | 56.8 kV |
Dielectric Strength | 17.9 kV/mm [454 V/mil] | |
Volume Resistivity | ASTM D257 | 9.3 x1015 ohm · cm |
Surface Resistivity | ASTM D257 | 8.9 x1013 ohm |
Dielectric Dissipation & Constant | ASTM D 150-98 | dissipation, D constant, k’ |
@1 kHz | 0.007 D, 2.96 k' | |
@10 kHz | 0.011 D, 2.81 k' | |
@100 kHz | 0.014 D, 2.83 k' | |
@1 MHz | 0.014 D, 2.83 k' | |
Insulating | Yes | |
Conductive | No | |
Cured Properties - Thermal | Test Method | |
Thermal Conductivity @25 °C [77 °C] | ASTM E 1461 92 | 0.218 W/m·K |
Glass Transition Temperature (Tg) | 68 °C | |
Coefficient of Thermal Expansion (CTE) | ASTM D 638 02a | 104 ppm/°C |
-40 °C to +50 °C | 75.7 ppm/°C | |
+25 °C to +250 °C | 140.2 ppm/°C | |
+100 °C to +250 °C | 154.0 ppm/°C | |
-40 °C to +250 °C | 125.3 ppm/°C | |
Thermal Diffusivity @25 °C [77 °C] | 1.33 x 10-7 m2/s | |
Specific Heat Capacity @25 °C [77 °C] | ASTM E 1269 01 | 1,419 J/(kg·K) |
Heat Deflection Temperature (HDT) | ASTM D 648 | 53.9 °C [129 °F] |
Uncured Properties - Physical | Part A | Part B |
Color | Black | Clear, Amber Tint |
Viscosity at 25°C [77°F] | 46,000 cP | 5,800 cP |
Density | 1.198 g/mL | 0.963 g/mL |
Flash Point | 150 °C [302 °F] | 110°C [230°F] |
% Solids | ~98% | 100% |
Odor | Mild | Musty |
Uncured Properties - Physical | Mixture (1.7A:1B by volume) | |
Color | Black | |
Viscosity at 24°C [73°F] | 40,000 cP [40.0 Pa·s] | |
Density | 1.12 g/mL | |
Mix Ratio by volume (A:B) | 1.7:1.0 | |
Mix ratio by weight (A:B) | 2:1 | |
Chemical Solvent Resistance | ||
Weight Change 3 days | Weight Change 45 days | |
Water | < 0% | < 1% |
Hydrocloric Acid | < 0% | < 1% |
Isopropyl Alcohol | 0.3% | < 1% |
Mineral spirits | 0.3% | 0.3% |
Xylene | 2% | 9% |
Ethyl Lactate | 3% | 7% |
Iso Hexanes | 5% | 8% |
Acetone | 7% | destroyed |
Sample Size (grams) | Peak Exotherm (Temp. in 0°C) | Time in Minutes |
50 | 44 | 155 |
100 | 63 | 110 |
500 | 110 | 65 |
Manufacturer (aka Brand): | MG Chemicals |
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