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High Temperature Epoxy Encapsulating and Potting Epoxy Compound, 3 litres (0.8 gallons) liquid

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    Purchase High Temperature Epoxy Encapsulating and Potting Epoxy Compound, 3 litres (0.8 gallons) liquid
    MFG Part Number: 832HT-3L

    High Temperature Epoxy Encapsulating and Potting Epoxy Compound, 3 litres (0.8 gallons) liquid

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    (USD) $167.46

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    The 832HT High Temperature Epoxy Encapsulating and Potting Compound is an electronic grade epoxy designed for high temperature environments. It is also an ideal encapsulant for very chemically aggressive environments where extreme physical strength is required.

    It protects against static discharges, shocks, vibrations, and mechanical impacts. It is extremely resistant to humidity, salt water, and harsh chemicals. It also helps protect intellectual property, and it much harder to remove than standard epoxy encapsulating compounds.

    Applications & Usages

    The 832HT epoxy is used to pot or encapsulate printed circuit assemblies. The protective cured epoxy improves reliability, operational range, and lengthens the life of electrical and electronic parts.

    Its primary applications are to protect electronic devices in high temperature and chemically aggressive environments. It is used in the automotive, marine, aerospace, aviation, communication, instrumentation, and industrial control equipment.

    Features Applications
    • High service temperature range of 225 °C [437 °F]
    • Very strong chemical resistance
    • Extremely strong Bis F epoxy compared to standard Bis A systems
    • Extremely resistant to water and humidity
    • Great intellectual property defense—the cured epoxy hides parts and defies removal attempts
    • Protects electronics from moisture, corrosion, fungus, thermal shock, and static discharges
    • Suitable for extreme environments to brine, acids, bases, and aliphatic hydrocarbons
    • Printed electronic circuits potting and encapsulation
    • Visual inspection protection
    • Printed circuit boards insulation
    Catalog Number Sizes Available Description
    832HT-375ML 340 ml (11.5 fl oz) Liquid
    832HT-3L 2.3 L (2.43 qt) Liquid

    Features

    • Maximum service temperature of 275C (527F)
    • Extreme physical strength and chemical resistance
    • Suitable for extreme environments, such as submersion in salt water, acids, bases, fuels, and alcohols
    • Extremely difficult to remove - grants incredible technology protection
    • Protects against strong vibrations, abrasions, and direct physical impact
    • Format: Liquid, 2.55 L (2.7 qt)

    Download Specifications Download Acrobat Reader

    Specifications

    Curing & Work Schedule
    Working Life60 minutes
    Shelf Life5 year
    Full Cureat 20°C [68°F]24 hour
    at 65°C [149°F]60 minutes
    at 80°C [176°F]45 minutes
    at 100°C [212°F]35 minutes
    at 130°C [266 °F]25 minutes
    at 160°C [320 °F]15 minutes
    at 200°C [392 °F])10 minutes
    Storage Temperature
    of Unmixed Parts
    16 to 27°C [60 to 80°F]
    Curing & Work Schedule
    Constant Service Temp.-30°C to 200°C

    [-22 to 392°F]

    Max. Intermittent Temp.+250 °C [+482 °F]
    Min Intermittent Temp.40 °C [-40 °F]
    Cured Properties - PhysicalTest Method
    ColorVisualBlack
    Density (at 26°C)ASTM D 7921.16 g/cm3
    Hardness(Shore D durometer)86D
    Tensile StrengthASTM D 63854.22 N/mm2 [7,864 lb/in2]
    ElongationASTM D 6383.38%
    Lap Shear StrengthASTM D 100212.37 N/mm2 [1,794 lb/in2]
    Flexural StrengthASTM D 790100.66 N/mm2

    [14,600 lb/in2]

    ModulusASTM D 7902,751 N/mm2

    [399,000 lb/in2]

    Cured Properties - ElectricalTest Method
    Breakdown Voltage @0.630 mmASTM D 14926.4 kV
    Dielectric StrengthASTM D 14944.82 kV/mm [1138 V/mil]
    Breakdown Voltage @3.175 mm [1/8‖]Reference fit56.8 kV
    Dielectric Strength 17.9 kV/mm [454 V/mil]
    Volume ResistivityASTM D2579.3 x1015 ohm · cm
    Surface ResistivityASTM D2578.9 x1013 ohm
    Dielectric Dissipation & ConstantASTM D 150-98dissipation, D constant, k’
    @1 kHz0.007 D, 2.96 k'
    @10 kHz0.011 D, 2.81 k'
    @100 kHz0.014 D, 2.83 k'
    @1 MHz0.014 D, 2.83 k'
    InsulatingYes
    ConductiveNo
    Cured Properties - ThermalTest Method
    Thermal Conductivity @25 °C [77 °C]ASTM E 1461 920.218 W/m·K
    Glass Transition Temperature (Tg) 68 °C
    Coefficient of Thermal Expansion (CTE)ASTM D 638 02a104 ppm/°C
    -40 °C to +50 °C75.7 ppm/°C
    +25 °C to +250 °C140.2 ppm/°C
    +100 °C to +250 °C154.0 ppm/°C
    -40 °C to +250 °C125.3 ppm/°C
    Thermal Diffusivity @25 °C [77 °C] 1.33 x 10-7 m2/s
    Specific Heat Capacity @25 °C [77 °C]ASTM E 1269 011,419 J/(kg·K)
    Heat Deflection Temperature (HDT)ASTM D 64853.9 °C [129 °F]
    Uncured Properties - PhysicalPart APart B
    ColorBlackClear, Amber Tint
    Viscosity at 25°C [77°F]46,000 cP5,800 cP
    Density1.198 g/mL0.963 g/mL
    Flash Point150 °C [302 °F]110°C [230°F]
    % Solids~98%100%
    OdorMildMusty
    Uncured Properties - PhysicalMixture (1.7A:1B by volume)
    ColorBlack
    Viscosity at 24°C [73°F]40,000 cP [40.0 Pa·s]
    Density1.12 g/mL
    Mix Ratio by volume (A:B)1.7:1.0
    Mix ratio by weight (A:B)2:1
    Chemical Solvent Resistance
    Weight Change
    3 days
    Weight Change
    45 days
    Water< 0%< 1%
    Hydrocloric Acid< 0%< 1%
    Isopropyl Alcohol0.3%< 1%
    Mineral spirits0.3%0.3%
    Xylene2%9%
    Ethyl Lactate3%7%
    Iso Hexanes5%8%
    Acetone7%destroyed

    832B Peak Exotherm

    Sample Size (grams)Peak Exotherm
    (Temp. in 0°C)
    Time in Minutes
    5044155
    10063110
    50011065

    Manufacturer (aka Brand): MG Chemicals
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