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Black Thermally Conductive Epoxy Encapsulating & Potting Compound, 2 litres (0.5 gallons) liquid

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    Purchase Black Thermally Conductive Epoxy Encapsulating & Potting Compound, 2 litres (0.5 gallons) liquid
    MFG Part Number: 832TC-2L

    Black Thermally Conductive Epoxy Encapsulating & Potting Compound, 2 litres (0.5 gallons) liquid

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    (USD) $132.61

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    MG Chemicals Thermally Conductive Epoxy is 100% solids. It provides all of the protection our standard potting compounds do, but allows trapped heat to escape more readily. As well, this system has an extended working time and a convenient one to one mix ratio making it ideal for large batches, high volume production, and automatic dispensing.

    This is designed to be a high quality solution. It is formulated with undiluted Bis F resin, so it has superior physical properties to conventional diluted Bis A systems. Cured with a polyamide, it is not as brittle as the more common amine cured thermally conductive systems, and can be machined to shape. Filled with high purity aluminum oxide powder it has excellent thermal conductivity at reasonable cost, and is free of zinc oxide and other environmental pollutants. As well, it is pigmented black for maximum radiative cooling via black body radiation.

    Catalog Number Sizes Available Description
    832TC-450ML 450 ml kit (15.2 fl oz) Liquid
    832TC-2L 1.7 L kit (0.45 gal) Liquid


    832TC-40L 40 L kit (10.7 gal) Liquid
    Features Applications
    • Thermal conductivity: 0.68 W/m*K
    • Pigmented black for maximum radiative cooling
    • Two-part system
    • 1:1 mix ratio
    • Two hour working time
    • Zinc oxide free
    • Provides superior protection from impact, shock, conductivity, moisture, abuse, chemicals, and analysis
    • Excellent machining properties
    • Cures in two hours at 65°C (150°F)
    • Extremely difficult to remove - grants incredible technology protection
    • Black colour prevents visual inspection
    • Provides technology protection, very hard to remove
    • Simple to mix and use
    • Printed electronic circuits potting and encapsulation
    • Visual inspection protection
    • Printed circuit boards insulation

    Features

    • Provides superior protection from impact, shock, conductivity, moisture, abuse, chemicals, and analysis
    • Two part epoxy, with a 1 to 1 mixing ratio by volume.
    • Two hour working time
    • Suitable for large production runs
    • Excellent machining properties
    • Format: Liquid, 1.7 L (57 fl oz)
    Download Specifications Download Acrobat Reader

    Specifications

    Uncured Properties - Resin [Part A]
    Viscosity at 25ºC (73ºF), 30 RPM17,920 cps
    Specific Gravity1.8019
    ColorBlack
    Uncured Properties - Hardener [Part B]
    Viscosity at 25ºC (73ºF), 30 RPM23,070 cps
    Specific Gravity1.5036
    ColorBlack
    Cured Properties - PHYSICALTest Method
    Mixed Viscosity at 25ºC (77ºF), 10 RPM38,000 - 40,000 cps
    Mixed Specific Gravity1.6156
    Volume Mix Ratio (resin:hardener)1:1
    Working time (100 g)120 min.
    Cure Time (150 g)at 25°C96 hours
    at 45°C8 hours
    at 55°C4 hours
    at 65°C2 hours
    Shore Hardness82 Shore D
    Tensile strengthASTM-D-638-02A2734 psi
    ElongationASTM-D-638-02A1.87%
    Compressive StrengthASTM-D-695-02A4,088 psi
    Flexural StrengthASTM-D-790-035,352 psi
    Cantilever Beam (IZOD) ImpactASTM-D-256-02 E10.80 ft lb ft / in
    Shear StrengthASTM-E-831-033,224 psi
    Cured Properties - TEMPERATURETest Method
    Constant Service Temperature-30 to-140 °C (-22 to 284 °F)
    Heat Deflection TemperatureASTM-D-648-0135.35 °C (95.6 °F)
    Maximum Withstand Temperature225 °C (437 °F)
    Cured Properties - ELECTRICALTest Method
    Dielectric ConstantASTM-D-150-984.41
    Dissipation FactorASTM-D-150-980.0113
    Volume ResistivityASTM-D-257-992.58 x 1015 ohm · cm
    Surface ResistivityASTM-D-257-993.16 x 1016 ohm · cm
    Cured Properties - THERMALTest Method
    Thermal Conductivityin W/m·K (BTU in /(hr ft2 F)) 0.682 (4.73)
    Thermal Diffusivity0.38 mm2/s
    Volumetric Specific Heat1.9MJ/m3*K
    Thermal ExpansionASTM-E-831-03148.3x10-6 mm/mm °C
    Chemical and Solvent ResistanceChange after 3 days:
    Hydrocloric Acid< 0.50%
    Isopropyl Alcohol~ 0%
    Ethyl Lactate< 1%
    Acetone< 3%
    Xylene< 2%
    Isohexanes~ 0%
    Mineral spirits~ 0%

    Manufacturer (aka Brand): MG Chemicals
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