Solder Paste in jar 250g (T5) Sn42/Bi57.6/Ag0.4 Low Temperature

Lead-Free / RoHS Compliant
Description
Solder Paste in jar 250g (T5) Sn42/Bi57.6/Ag0.4 Low Temperature 89.5% metal melts @ 138C, 281F.

Alloy: Sn42/Bi57.6/Ag0.4
Flux Type: Synthetic No-Clean
Flux Classification: REL0
Metal Content: 89.5% metal by weight.
Particle Size: T5 (15-25 microns)
Melting Point: 138C (281F)
Size: 250g jar

Shelf Life
Refrigerated >6 months, unrefrigerated >2 months

Stencil Life
>8 hours @ 20-50% RH 22-28C (72-82F)
>4 hours @ 50-70% RH 22-28C (72-82F)

Stencil Cleaning
Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA).

Storage and Handling
Refrigerate at 3-8C (37-46F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use.

Transportation
This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.