Sn/Cu/Ni + Ge alloy Bright solder joints, improved wetting Melting Point 227C
SN100C is a lead-free solder alloy developed by Nihon Superior in Japan that is comprised of tin-copper-nickel + germanium. SN100C offers user-friendly properties and has been proven in commercial production since 1999. The result of these advantages is that SN100C offers high-throughput and the lowest cost of ownership as compared to any other lead-free solder alloy.
Customer experience over several years is that the TOTAL cost of running a standard wave soldering machine with SN100C when all factors are taken into account can be up to one third the cost of running the same machine with tin-silver-copper alloys. The actual saving in each case will depend on the number of factors that apply, but the cost of running a line with SN100C is always lower than the cost of running the same line with tin-silver-copper.
Features
- Does not contain silver or bismuth.
- Eutectic alloy.
- Bridge-free and icicle-free soldering.
- Smooth, bright, well-formed fillets, free of gross micro-cracks, irrespective of the cooling rate.
- Good through-hole penetration.
- Good topside fillet formation.
- Dross rate equal or lower than tin-lead solder.
- Does not require a nitrogen atmosphere.
- Does not erode copper from holes, pads and tracks.
- Low rate of copper leaching makes it easy to control the copper content of the solder bath.
- Lower aggressiveness to stainless steel and other solder pot materials as compared to tin-silver-copper alloys.
- Thermal fatigue resistance and creep strength better than tin-lead.
- Slow, even growth of the intermetallic layer at the solder/substrate interface.
- Also performs well in selective and dip soldering.
- Format: Spool, 1/2 lb (227g)
- RoHS Compliant: Yes
Manufacturer (aka Brand): | AIM Solder |
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