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Thumbnail Filmstrip of 4900P-250G Lead Free Solder Paste, Sac305, No Clean Jar 250 g (8.8 oz) Images
The 4900P No Clean Solder Paste is made from a blend of high-purity, non-recycled tin, silver, and copper metal powder mixed with a no clean flux. This lead-free and halogen-free solder paste is designed for extreme flux activity and enhanced printing characteristics needed for ultra-fine pitch applications. It provides excellent wetting on copper OSP-coatings. Wide reflow process windows combined with high thermal stability yield solder joints with smooth surfaces.
Applications & Usages
The solder paste is designed to accommodate high speed printing. It can yield brick-like prints even when using an ultra-fine pitch stencils down to 0.3 mm.
| Catalog Number | Sizes Available | Description |
|---|---|---|
| 4900P-25G | 25 g (0.88 oz) | Syringe |
| 4900P-250G | 250 g (8.81 oz) | Jar |
| Features |
|
Features
- Format: Jar, 250g (9 oz)
- RoHS Compliant: Yes
| Manufacturer (aka Brand): | MG Chemicals |
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