Slow Cure Thermally Conductive Adhesive (Ratio 1:1), 50 ml (113 g), 2 jar kit

This high thermal conductivity adhesive paste is a 2-part epoxy with a long 4-hour working time.  It is dark grey, smooth, viscous, thixotropic, and bonds well to a wide variety of substrates.

•  Thermal conductivity of 1.4 W/ (m K)
•  1:1 mix ratio
•  Working time: 4 hours
•  Cure time: 1 hour at 80°C (176°F)
•  Provides strong electrical insulation
•  High tensile strength
•  Strong resistance to humidity, salt water, mild bases, and aliphatic hydrocarbons
•  Meets NASA low outgassing standard