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Thumbnail Filmstrip of Sn63/Pb37, No Clean Solder Wire , 0.032" dia. 1/2 lb Images
Sn63/Pb37 No-Clean Solder Wires is electronics grade solder wire. This no-clean solder wire uses the standard eutectic tin-to-lead alloy ratio, which is complemented by a no-clean, synthetically refined, splatter-proof, resin flux core. It meets J-STD-004B, ASTM B 32, and exceeds J-STD-006C specifications. 63/67 solder wire is one of the easiest solders to work with because it combines a low-melting temperature with a sharp melting/solidification point, which results in robust and reliable joints that are highly resistant to whisker formation.
• Eutectic alloy (liquids = solidus temperature)
• Alloy exceeds J-STD-006C and meets ASTM B 32 purity requirements
• Flux meets J-STD-004B
• Spreads lie rosin-activated flux
• Virtually non-splattering
• Non-corrosive residue
• Non-conductive residue
• Halide free
Features
- Meets J-STD-004 and QQ-S-571
- No Clean
- Standard Flux Core percentage at 2.2%
- Melting Point: 183�C / 361�F
- Format: Spool, 1/2 lb (227g)
- RoHS Compliant: No
| Manufacturer (aka Brand): | MG Chemicals |
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