4900P SAC305 Solder Paste is a no-clean solder paste made from a blend of high-purity, non-recycled tin, silver and copper metal powder mixed with a no-clean flux. This halogen-free and lead-free solder paste is designed for extreme flux activity and the enhanced printing requirements of ultra-fine pitch applications. It provides excellent wetting on copper OSP-coatings. Wide reflow process windows combined with high thermal stability yield solder joints with smooth surfaces.
4900P is the best lead-free solder paste for facilitating high speed printing. It can yield brick-like prints even when using ultra-fine pitch stencils as small as 0.3 mm.
Features & Benefits
4900P is the best lead-free solder paste for facilitating high speed printing. It can yield brick-like prints even when using ultra-fine pitch stencils as small as 0.3 mm.
Features & Benefits
- Alloy exceeds J-STD-006C and meets ASTM B 32 purity requirements
- Flux meets J-STD-004B
- Repeatable and consistent printing characteristics
- Long stencil and tack life facilitate high speed printing
- Excellent wettability
- Suitable for air or nitrogen atmospheres
- Medium-soft, non-cracking residues
Storage and Handling
Store refrigerated between 2–10 °C in an upright
position with tip down to prevent flux separation and air entrapment.
Store refrigerated between 2–10 °C in an upright
position with tip down to prevent flux separation and air entrapment.
Unopened Container
Shelf Life @ 2–10 ˚C 1 year
Shelf Life @ 20–25 ˚C 6 months
Shelf Life @ 2–10 ˚C 1 year
Shelf Life @ 20–25 ˚C 6 months
Features
- Low residues
- Easily dispensed
- Long tack-time
- Excellent wettability
- Hard non-conductive residues
- Format: Syringe, 10cc, 25g (0.88 oz)
- RoHS Compliant: Yes
Manufacturer (aka Brand): | MG Chemicals |
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