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Lead Free No Clean Solder Paste SAC305

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    Purchase Lead Free No Clean Solder Paste SAC305
    MFG Part Number: 4900P-25G

    Lead Free No Clean Solder Paste SAC305

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    (USD) $23.80

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    4900P SAC305 Solder Paste is a no-clean solder paste made from a blend of high-purity, non-recycled tin, silver and copper metal powder mixed with a no-clean flux. This halogen-free and lead-free solder paste is designed for extreme flux activity and the enhanced printing requirements of ultra-fine pitch applications. It provides excellent wetting on copper OSP-coatings. Wide reflow process windows combined with high thermal stability yield solder joints with smooth surfaces.

    4900P is the best lead-free solder paste for facilitating high speed printing. It can yield brick-like prints even when using ultra-fine pitch stencils as small as 0.3 mm.

    Features & Benefits
    • Alloy exceeds J-STD-006C and meets ASTM B 32 purity requirements
    • Flux meets J-STD-004B
    • Repeatable and consistent printing characteristics
    • Long stencil and tack life facilitate high speed printing
    • Excellent wettability
    • Suitable for air or nitrogen atmospheres
    • Medium-soft, non-cracking residues
    Storage and Handling
    Store refrigerated between 2–10 °C in an upright
    position with tip down to prevent flux separation and air entrapment.
    Unopened Container
    Shelf Life @ 2–10 ˚C 1 year
    Shelf Life @ 20–25 ˚C 6 months

    Features

    • Low residues
    • Easily dispensed
    • Long tack-time
    • Excellent wettability
    • Hard non-conductive residues
    • Format: Syringe, 10cc, 25g (0.88 oz)
    • RoHS Compliant: Yes
    Manufacturer (aka Brand): MG Chemicals
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