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Lead Free No Clean Solder Paste SAC305
Lead Free No Clean Solder Paste SAC305
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Manufacturer: MG Chemicals
Our Price: $33.20
Mfg Part Number: 4900P-25G


Availability: Available
Product Code: 4900P-25G_M100
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Description Technical Specs
 
4900P SAC305 Solder Paste is a no-clean solder paste made from a blend of high-purity, non-recycled tin, silver and copper metal powder mixed with a no-clean flux. This halogen-free and lead-free solder paste is designed for extreme flux activity and the enhanced printing requirements of ultra-fine pitch applications. It provides excellent wetting on copper OSP-coatings. Wide reflow process windows combined with high thermal stability yield solder joints with smooth surfaces.

4900P is the best lead-free solder paste for facilitating high speed printing. It can yield brick-like prints even when using ultra-fine pitch stencils as small as 0.3 mm.

Features & Benefits
  • Alloy exceeds J-STD-006C and meets ASTM B 32 purity requirements
  • Flux meets J-STD-004B
  • Repeatable and consistent printing characteristics
  • Long stencil and tack life facilitate high speed printing
  • Excellent wettability
  • Suitable for air or nitrogen atmospheres
  • Medium-soft, non-cracking residues
Storage and Handling
Store refrigerated between 2–10 °C in an upright
position with tip down to prevent flux separation and air entrapment.
Unopened Container
Shelf Life @ 2–10 ˚C 1 year
Shelf Life @ 20–25 ˚C 6 months
Features
  • Low residues
  • Easily dispensed
  • Long tack-time
  • Excellent wettability
  • Hard non-conductive residues

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