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Medium Cure Thermal Conductive Adhesive
Medium Cure Thermal Conductive Adhesive

Our Price: $20.85
Mfg Part Number: 8329TCM-6ML

Availability: Available
Product Code: 8329TCM-6ML_M100
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Description Technical Specs
The 8329TCM is used for thermal management situations requiring superior bonding strengths and good thermal transfers. For example, it is used to as a die-attach for electrical and electronics, increasing their long term reliability. It is great for heat sink bonding. It is also used as a high-powered LED adhesive that maximizes the lifetime of LEDs by dissipating their heat.

The 8329TCM Medium Cure Thermal Conductive Adhesive is an electronically insulating epoxy that combines moderate curing rate and high thermal conductivity. It has a convenient 1-to-1 ratio, a workable 45 minutes pot life, and a moderate curing rate. It may achieve a minimal service cure in seven hours at room temperature. The cured adhesive bonds very well to most substrates used in electronic assemblies; and resists thermal and mechanical shocks.

Application Instructions

Follow the procedure below for best results. For mixing quantities that are less than 1 mL in size or for stricter stoichiometry control, mix by weight ratio instead (requires a high precision balance). Heat cure is recommended to get the best possible conductivity.
To prepare 1:1 (A:B) mixture
Remove cap or cover.
Measure one part by volume of A.
Measure one part by volume of B.
Thoroughly mix the parts together with a stir stick until homogeneous.
Apply with an appropriate sized stick for the application area.
Note: Remember to recap the syringe or container promptly after use.
Tip: Note that the material viscosity decreases with mixing, so the material will be most liquid-like and easily applied immediately after being mixed. Due to short cure time, apply as soon as possible after mixing.
To heat cure the 8329TCF
Put in oven at 65 °C [149 °F] for 15 minutes.
Tip: Hair dryers are normally rated not to exceed 60 °C, so they can generally be used to accelerate the cure.
Attention: Keep the curing temperature well below temperature limit of heat sensitive components that may be present. As a guideline, remember that commercial grade devices normally can be safely operated up to 70 °C, industrial grade up to 85 °C, and military grade up to 175 °C.
Attention: Heat guns can easily exceed the temperature limits for your assembly: they should not be used.
  • Excellent 1.36 W/(m•K) thermal conductivity
  • Easy 1:1 mix ratio
  • Adheres to most electronic substrates
  • Stores and ships at slightly below room temperature — no freezing or dry ice required
  • Very long shelf life of at least two years — even when stored at room temperature
  • Strong water and chemical resistance to brine, acids, bases, and aliphatic hydrocarbons

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