Thumbnail Filmstrip of Silicone Heat Transfer Compound 1 pint (2.5 lbs) Tub Images
860 is a CPU heat sink compound. Our thermal paste designed to reduce thermal resistance between irregular metal surfaces. Coupled with reasonable thermal conductivity, 860 has a soft consistency and a wide operating temperature range, which in some instances makes it the best thermal paste for CPUapplications.
This silicone-based PC thermal paste is mostly used to improve heat flow between heat sinks and heat-generating components, such as CPUs, GPUs, LEDs, motors, and power components.
For a silicone-free thermal paste, try 8616.
| Catalog Number | Sizes Available | Format |
|---|---|---|
| 860-4G | 1.7 mL (0.06 fl oz) | Pouch a) |
| 860-60G | 25 mL (0.84 fl oz) | Jar |
| 860-150G | 62.5 mL (2.11 fl oz) | Tube |
| 860-1P | 470 mL (15.9 fl oz) | Jar |
a) Case pack of 100 pouches
| Features | Applications |
|
|
Features
- Very high maximum operating temperature (-68°C - +200°C)
- Good thermal conductivity
- High dielectric strength
- Non-bleeding
- Non-conductive
- Long service life
- Safe on plastics
- Provides excellent corrosion resistance
- Contact conductivity improvement
- Format: Tube, 1 kg, 470 ml (2.2 lbs)
| Manufacturer (aka Brand): | MG Chemicals |
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