Thumbnail Filmstrip of Silicone Heat Transfer Compound 4g Singles Images
860 is a CPU heat sink compound. Our thermal paste designed to reduce thermal resistance between irregular metal surfaces. Coupled with reasonable thermal conductivity, 860 has a soft consistency and a wide operating temperature range, which in some instances makes it the best thermal paste for CPUapplications.
This silicone-based PC thermal paste is mostly used to improve heat flow between heat sinks and heat-generating components, such as CPUs, GPUs, LEDs, motors, and power components.
For a silicone-free thermal paste, try 8616.
| Catalog Number | Sizes Available | Format |
|---|---|---|
| 860-4G | 1.7 mL (0.06 fl oz) | Pouch a) |
| 860-60G | 25 mL (0.84 fl oz) | Jar |
| 860-150G | 62.5 mL (2.11 fl oz) | Tube |
| 860-1P | 470 mL (15.9 fl oz) | Jar |
a) Case pack of 100 pouches
| Features | Applications |
|
|
Features
- High thermal conductivity
- High dielectric constant
- High dissipation factor
- Use with heat sinks or metal chassis
- Will not dry or harden
- Contains zincs oxides and polydimenthyl siloxane
- Non-silicone version available
- Format: Singles, 4 g, 1.7 ml (0.1 oz)
| Manufacturer (aka Brand): | MG Chemicals |
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