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Silicone Heat Transfer Compound 4g Singles
Silicone Heat Transfer Compound 4g Singles


 
Our Price: $2.05
Mfg Part Number: 860-4G


Availability: Available
Product Code: 860-4G_M100
Qty :

Description
 

860 is a CPU heat sink compound. Our thermal paste designed to reduce thermal resistance between irregular metal surfaces. Coupled with reasonable thermal conductivity, 860 has a soft consistency and a wide operating temperature range, which in some instances makes it the best thermal paste for CPUapplications.

This silicone-based PC thermal paste is mostly used to improve heat flow between heat sinks and heat-generating components, such as CPUs, GPUs, LEDs, motors, and power components.

For a silicone-free thermal paste, try 8616.

Catalog Number Sizes Available Format
860-4G 1.7 mL (0.06 fl oz) Pouch a)
860-60G 25 mL (0.84 fl oz) Jar
860-150G 62.5 mL (2.11 fl oz) Tube
860-1P 470 mL (15.9 fl oz) Jar

a) Case pack of 100 pouches 

 

Features Applications
  • Thermal conductivity of 0.7 W/(m·K)
  • High dielectric strength
  • Broad service temperature range of -40 to 200 °C (-40 to 392 °F)
  • Excellent corrosion resistance
  • Non-bleeding heat transfer paste
  • Non-electrically conductive
  • Long service life
  • Irregular surfaces conductivity improvement
Features
  • High thermal conductivity
  • High dielectric constant
  • High dissipation factor
  • Use with heat sinks or metal chassis
  • Will not dry or harden
  • Contains zincs oxides and polydimenthyl siloxane
  • Non-silicone version available

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