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AIM Solder SN100C .032" 3% Water Soluble 482 Flux, Wire Solder 1 lb Spool
AIM Solder SN100C .032" 3% Water Soluble 482 Flux, Wire Solder 1 lb Spool


 
Manufacturer: AIM Solder

Our Price: $58.16
Mfg Part Number: SODR14033
(Minimum order):  12

Availability: Available
Product Code: SODR14033_A222
Qty :

Description
 
Sn/Cu/Ni + Ge alloy Bright solder joints, improved wetting Melting Point 227C

SN100C is a lead-free solder alloy developed by Nihon Superior in Japan that is comprised of tin-copper-nickel + germanium. SN100C offers user-friendly properties and has been proven in commercial production since 1999. The result of these advantages is that SN100C offers high-throughput and the lowest cost of ownership as compared to any other lead-free solder alloy.

Customer experience over several years is that the TOTAL cost of running a standard wave soldering machine with SN100C when all factors are taken into account can be up to one third the cost of running the same machine with tin-silver-copper alloys. The actual saving in each case will depend on the number of factors that apply, but the cost of running a line with SN100C is always lower than the cost of running the same line with tin-silver-copper.
Features
  • Does not contain silver or bismuth.
  • Eutectic alloy.
  • Bridge-free and icicle-free soldering.
  • Smooth, bright, well-formed fillets, free of gross micro-cracks, irrespective of the cooling rate.
  • Good through-hole penetration.
  • Good topside fillet formation.
  • Dross rate equal or lower than tin-lead solder.
  • Does not require a nitrogen atmosphere.
  • Does not erode copper from holes, pads and tracks.
  • Low rate of copper leaching makes it easy to control the copper content of the solder bath.
  • Lower aggressiveness to stainless steel and other solder pot materials as compared to tin-silver-copper alloys.
  • Thermal fatigue resistance and creep strength better than tin-lead.
  • Slow, even growth of the intermetallic layer at the solder/substrate interface.
  • Also performs well in selective and dip soldering.

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