The THT (Through-Hole Technology) and SMT (Surface Mount Technology) Soldering Course provides comprehensive training in the assembly, soldering, inspection, and rework of electronic components used in modern electronic manufacturing and repair. Designed for beginners and intermediate-level technicians, this hands-on course develops the practical skills required to produce reliable, high-quality solder connections on printed circuit boards (PCBs).

Participants will learn the fundamentals of electronic assembly, component identification, soldering tools and materials, and industry-standard soldering practices. The course covers both through-hole and surface-mount technologies, enabling participant work confidently with a wide range of electronic components and PCB assemblies.

Through a combination of classroom instruction and practical exercises, students will gain experience in manual soldering techniques, component installation, desoldering, rework procedures, and quality inspection. Emphasis is placed on workmanship standards, process control, ESD protection, and the prevention of common soldering defects.

Course Topics Include:
• Introduction to PCB assembly and electronic components
• THT component identification and installation
• SMT component handling and placement
• Soldering station setup and maintenance
• Hand soldering techniques for THT components
• Hand soldering techniques for SMT components
• Desoldering and component removal methods
• Rework and repair procedures
• Solder joint inspection and quality criteria
• Common soldering defects and corrective actions
• ESD awareness and control procedures
• Safe handling of tools, materials, and assemblies

Learning Outcomes:
Upon successful completion of the course, participants will be able to Identify and handle THT and SMT components safely. Perform reliable soldering and desoldering operations on printed circuit boards.
Assemble electronic circuits according to industry workmanship standards. Inspect solder joints and identify defects. Apply rework and repair techniques to electronic assemblies. Follow ESD and safety requirements in electronics manufacturing and repair environments.

Target Audience:
• Electronics Assembly Operators
• Electronics Technicians
• Manufacturing Personnel
• Maintenance Technicians
• Students and Apprentices
• Quality Inspectors
• Anyone seeking practical PCB assembly and soldering skills

Course Duration:
3 Days (customizable)

Training Format:
Instructor-led theory sessions combined with extensive hands-on practical exercises using THT and SMT assemblies.

Certification:
Participants who successfully complete the practical and theoretical assessments will receive a Certificate of Completion in THT & SMT Soldering Techniques.

The Advanced Micro SMT (Surface Mount Technology) Soldering Course is designed for technicians, engineers, electronics repair specialists, and manufacturing professionals who want to develop expert-level skills in soldering and reworking miniature surface-mount electronic components. This hands-on training program focuses on precision soldering techniques required for today's high-density electronic assemblies and microelectronics.

Participants will learn advanced methods for soldering, desoldering, rework, inspection, and repair of fine-pitch components, including chip resistors, capacitors, QFPs, QFNs, BGAs, micro-BGAs, and other complex SMT packages. The course covers industry best practices for thermal management, flux selection, solder alloys, microscope-assisted soldering, hot air rework, and defect prevention.

Through practical laboratory exercises, students will gain experience using professional soldering stations, rework equipment, microscopes, and inspection tools while developing the precision and confidence needed to work on highly sensitive electronic assemblies. Emphasis is placed on workmanship standards, quality control, ESD protection, IPC guidelines, and troubleshooting common soldering defects.

Course Topics Include:
• Advanced SMT soldering techniques
• Fine-pitch and ultra-miniature component handling
• BGA and micro-BGA rework fundamentals
• Hot air and infrared rework methods
• Microscope-assisted soldering and inspection
• PCB pad repair and trace restoration
• Solder joint analysis and quality assessment
• ESD control and safe work practices
• IPC standards and workmanship requirements
• Defect identification, troubleshooting, and repair

Learning Outcomes:
Upon completion of the course, participants will be able to perform complex SMT soldering and rework operations with a high degree of accuracy, inspect and evaluate solder joint quality, repair damaged PCB assemblies, and apply industry-standard procedures to ensure reliable and repeatable results in manufacturing and electronics repair environments.

Target Audience:
• Electronics Technicians
• PCB Repair Specialists
• Manufacturing Operators
• Quality Control Inspectors
• Aerospace and Defense Technicians
• Medical Electronics Technicians
• Engineering and R&D Personnel

Course Duration: 2 Days (customizable)
Training Format: Classroom Instruction, Demonstrations, and Extensive Hands-On Practice
Certification: Certificate of Completion awarded upon successful course completion.